Customized 0.6mm 10.0mm Multilayer PCB Assembly Power Bank Module

Contact me for free samples and coupons.
Whatsapp:0086 18588475571
Wechat: 0086 18588475571
Skype: sales10@aixton.com
If you have any concern, we provide 24-hour online help.
xType | FR4 Pcb Circuit Board | Layer Count | 4-30L |
---|---|---|---|
Matierial | FR4 (Tg130~Tg170) CEM1,CEM3 | Board Thickness | 0.6~10.0mm |
Copper Thickness | Hoz~3oz | Solder Mask | Green, Yellow, Blue, Black, White... |
Surface Treatment | ENIG,OSP,HASL,Imm Tin,Imm Silver... | Certificates | ISO9001,ISO14001,IATF16949 |
Product Type | OEM PCB Mannufacturer | Application Segment | Auto,Industrial,Medical,DataCom、Comsumer |
Highlight | 10.0mm Multilayer PCB Assembly,0.6mm Multilayer PCB Assembly,0.6mm Custom Printed Circuit Board |
Customized 0.6mm 10.0mm Multilayer PCB Assembly Power Bank Module
Power Bank Module Custom Pcb Printed Circuit Board Factory Multilayer PCB Assembly
Quality & OTD Target
Certificates
UL Underwriter Laboratories Certificate
ISO9001 Quality System Certificate
ISO14001 Environment System Certificate
IATF16949 Automotive Certificate
ISO13485 Medical Certificate
TL9000 Telecom Certificate
CIT Certificate of IPC Trainer IPC
Specification:
Multilayer PCB
|
Special Tech
|
|
Application Segment:
|
Auto,Industrial,Medical,DataCom,Consumer
|
1.Impedance
2.Via Filling 3.PFH,Backdrill 4.Mix Finishes 5.Cave 6.heatsink 7.ENEPIG |
Layer Count:
|
4~50L
|
|
Material:
|
FR4 (Tg130~Tg170)
|
|
Board Thickness(mm):
|
0.6mm~10.0mm
|
|
Copper Thickness(oz):
|
Hoz~3oz
|
|
Size(mm):
|
5mm~1200mm
|
|
Min. LW/LS(mm):
|
0.1/0.1
|
|
Min. Hole(mm):
|
0.25
|
|
Solder Mask:
|
Green, Yellow, Blue, Black, White...
|
|
Surface Finish:
|
ENIG,OSP,HASL,Imm Tin,Imm Silver...
|
|
Certificate:
|
RoHS/ISO9001/ISO14001
|
|
Service:
|
OEM / DFM
|
Business content
1. One-stop service
2. OEM service
3. Gerber file needed
4. PCB clone with sample
5. Quality guarantee and professional after-sell service
Best raw materials
High TG, FR4, high frequency(Rogers,Teflon, ARLON, TYCONIC), Halogen-free
Advanced technology
min/T/G:3/3 mil
Impedance control ±10%
MAX aspect ratio for board thickness vs drill bit size 15:1
surface treatment :HASL, Gold plating, Immersuin gold, Immersuin tin, Immersion silver, Gold fingers, OSP
Advanced equipment
Solder Paste Jet | X-RAY | AOI |
Wave Soldering | Reflow | X-RAY Counter |
Surface Mount Machine | On-line AOI | MY-500 |
SPI |
Why choose us?
Our Advantage:
1.Support customized
- A gobal independent distributors of electronic components
- Welcome OEM, ODM.
- A variety of channels to satisfy various demands
Most of them are in stock with very competitive price
2. Quality:
- Original :100% new and original factory packing. Rohs. No bulk, no refurbish, no obsolete.
3. For the faulty:
- Firstly, products are produced in strict quality control system by manaufacturer .
- For some defective batch products, we will send them to factory and resend them to you or we can discuss the real situation.
Product Image:
FAQ
Q1.What is needed for FPC/ PCB /PCBA quotation?